Ultra High Purity Material Tungsten Alloy Sputtering Target

Basic information of tungsten target

Product name: tungsten target

Size: According to request

Surface:bright and clean

Shape:round disc, sheet...

Grade:W1

Standard:ASTM B760

Purity:≥99.95%

Density:19.2g/cm³

Melting point:3410+/-20℃

Boiling point:

Application:vacuum coating

The most important points about tungsten targets

(1) The purity of the film should be high;

(2)The film thickness should be relatively uniform.

(3) Deposition rate. If the deposition rate is properly increased, the sputtering rate will also increase.

(4) Selection of sputtering gas. Argon gas is usually selected as the sputtering gas.

(5) Sputtering voltage and substrate potential. The substrate cannot be suspended.

(6) The temperature of the substrate. Excessive temperature will affect the structure of the film.

(7) Purity of tungsten target. Oxides and impurities on the surface of the tungsten target will contaminate the purity of the film.

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